Extract:
The 3D ICs market is said to witness a significant growth during the forecast years between 2021 and 2028. A three-dimensional integrated circuit (3D IC) is a metal-oxide-semiconductor integrated circuit created by vertically stacking silicon wafers or dies. 3D ICs are employed as a single device to boost performance while consuming less power and taking up less space.
Report Scope in detail:
This latest report edition of 3D ICs market has been added to our huge database of detailed reports and this envisions to shape the future of all the related businesses. Our team of learned research analysts have studied in-depth and curated the report based on several aspects which include the overview of the market, driving forces, growth rate, market trends, market size, opportunities and challenges of the market; along with detailed competitive analysis on the regional as well as global level. The 3D ICs market research report renders a thorough analysis of the market on a global aspect and aims on several market segmentation. This report also provides deeper perception into the latest trends of the market and pinpoints crucial product developments of the industry. Furthermore, the report collects numerous factors that have accredited to the growth of the market in the recent years.
Market Dynamics:
- Multiple layers of active electronic components are horizontally and vertically combined on a single chip in 3D ICs.
- The rapid expansion of the electronics sector has accelerated advancements such as three-dimensional integrated circuits.
- The global electronics sector is seeing increased demand for systems with higher performance, optimum working, and minimal reaction as the trend toward mobile, fast, compact, and easy-to-use goods grows.
- There aren't enough foundries or competent workers to make 3D ICs, especially in rising economies like the Philippines, Brazil, and Africa.
3D ICs Market Segmentation:
By Substrate Type
- Bulk silicon
- Silicon on insulator (SOI)
By Fabrication Process
- Silicon epitaxial growth
- Beam re-crystallization
- Solid phase crystallization
- Wafer bonding
By Product
- MEMS and Sensor
- Optoelectronics and imaging
- RF SiP
- Memories (3D Stacks)
- HB LED
- Logic (3D Sip/Soc)
By End Use
- Information and communication technology
- Consumer electronics
- Transport (automotive and aerospace)
- Military
- Others (Research & Development)
Regional Coverage
- North America
- United States
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Italy
- Spain
- Russia
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- Korea
- Australia
- Southeast Asia
- Rest of Asia-Pacific
- South America
- Brazil
- Argentina
- Colombia
- Rest of South America
- Middle East & Africa
- GCC
- South Africa
- Rest of Middle East & Africa
Competitive Analysis:
Eminent market players have been outlined in order to extract improved insights into the worldwide businesses. Our research reports offer all-inclusive information on various top most manufacturers that are operational across global regions. We provide company profiles which include detailed overview of the company, business information, business performance, crucial strategies implemented through the years.
Few of the Key Players Covered in Our Report:
- MonolithIC 3D Inc.
- Taiwan Semiconductor Manufacturing Company, Ltd
- Elpida Memory, Inc.
- Micron Technology, Inc.
- Ziptronix, Inc.
- The 3M Company
- STATS ChipPAC Ltd.
- United Microelectronics Corporation
- Tezzaron Semiconductor Corporation
- XILINX, Inc.
Impact of COVID19:
The COVID19 pandemic crippled the global economy, it resulted in a worldwide lockdown and this has majorly impacted numerous industries. Our industry experts are working round-the-clock to identify, accumulate and in-time deliver market analysis due to the effect of unprecedented decisions in COVID-19 repercussions on many businesses. The full version of this report will comprise the overall impact of the pandemic, and predicted alteration on the future outlook of the industry, by taking into the account the economic, political, technological and social parameters.
This research study involves broad usage of both secondary and primary data sources. The research process involves the identification of numerous factors which affect the industry, comprising the market environment, government policy, historical data, present trends in the market, competitive landscape, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges.
Market Estimation
Top-down and bottom-up approaches are used for validating the market size for companies, regional segments along with relevant market segmentations such as product type and application.
This report includes market estimations which are based on the marketed sale price of a product. Further breakdown of product segments, particular market share are formed based on the weightage assigned to every segment, which is derived of their usage rate and average price. The entire probable factors which effect the markets and influence them in a great way are included in this research report; and have been accounted for, studied in-depth and are confirmed through primary research. These are then studies to get the final qualitative and quantitative data. Any of the factors such as the outcome of inflation, economic downfall, and any kind of policy and regulatory alterations and/or other such factors are not accounted for in the market forecast. All of this data is amalgamated and included with thorough inputs and analysis from Gravitas Market Insights is curated in this report.
Along with the previously mentioned approaches, various data triangulation methods, in order to conduct market estimations and market forecasting for the complete market segments are detailed in this report. Key Companies present in the said market are also acknowledged via in-depth secondary research and primary research.
Section 1: Executive Summary
1.1. 3D ICs Market Industry 360° outline, Year 2016 – 2028
1.2. Business Model Trends
1.3. Growth Trends
1.4. End-User/Fabrication Process Trends
1.5. Regional Trends
Section 2: Market Dynamics - 3D ICs Market Industry Insights
2.1. Growth Drivers
2.2. Opportunities
2.3. Industry challenges
2.4. SWOT Analysis
2.5. Porter’s Analysis
2.6. Worldwide Industry Landscape, Year 2016 – 2028
2.7. Industry Segmentation
2.8. Technology & Invention landscape
2.9. Regional Landscape
2.9.1. North America
2.9.2. Europe
2.9.3. Asia-Pacific
2.9.4. South America
2.9.5. Middle East & Africa
2.10. Competitive Environment
Section 3: Global 3D ICs Market, By Substrate Type
3.1. Segmentation Analysis, By Substrate Type, 2016-2028
3.2. Market Share Segmentation Analysis, By Substrate Type, 2016-2028
3.3. Bulk silicon
3.3.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
3.4. Silicon on insulator (SOI)
3.4.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
Section 4: Global 3D ICs Market, By Fabrication Process
4.1. Segmentation Analysis, By Fabrication Process, 2016-2028
4.2. Market Share Segmentation Analysis, By Fabrication Process, 2016-2028
4.3. Silicon epitaxial growth
4.3.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
4.4. Beam re-crystallization
4.4.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
4.5. Solid phase crystallization
4.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
4.6. Wafer bonding
4.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
Section 5: Global 3D ICs Market, By Product
5.1. Segmentation Analysis, By Product, 2016-2028
5.2. Market Share Segmentation Analysis, By Product, 2016-2028
5.3. MEMS and Sensor
5.3.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
5.4. Optoelectronics and imaging
5.4.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
5.5. RF SiP
5.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
5.6. Memories (3D Stacks)
5.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
5.7. HB LED
5.7.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
5.8. Logic (3D Sip/Soc)
5.8.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
Section 6: Global 3D ICs Market, By End Use
6.1. Segmentation Analysis, By End Use, 2016-2028
6.2. Market Share Segmentation Analysis, By End Use, 2016-2028
6.3. Information and communication technology
6.3.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
6.4. Consumer electronics
6.4.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
6.5. Transport (automotive and aerospace)
6.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
6.6. Military
6.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
6.7. Others (Research & Development)
6.7.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
Section 7: Global 3D ICs Market, Regional Analysis
7.1. Global 3D ICs Market, Regional Analysis
7.2. North America, Country level Analysis
7.2.1. North America 3D ICs Market estimates and forecast with Growth rate analysis, By Substrate Type, 2016 – 2028
7.2.2. North America 3D ICs Market estimates and forecast with Growth rate analysis, By Fabrication Process, 2016 – 2028
7.2.3. North America 3D ICs Market estimates and forecast with Growth rate analysis, By Product, 2016 – 2028
7.2.4. North America 3D ICs Market estimates and forecast with Growth rate analysis, By End Use, 2016 – 2028
7.2.5. United States
7.2.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.2.6. Canada
7.2.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.2.7. Mexico
7.2.7.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.3. Europe Country level Analysis
7.3.1. Europe 3D ICs Market estimates and forecast with Growth rate analysis, By Substrate Type, 2016 – 2028
7.3.2. Europe 3D ICs Market estimates and forecast with Growth rate analysis, By Fabrication Process, 2016 – 2028
7.3.3. Europe 3D ICs Market estimates and forecast with Growth rate analysis, By Product, 2016 – 2028
7.3.4. Europe 3D ICs Market estimates and forecast with Growth rate analysis, By End Use, 2016 – 2028
7.3.5. UK
7.3.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.3.6. Germany
7.3.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.3.7. France
7.3.7.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.3.8. Italy
7.3.8.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.3.9. Spain
7.3.9.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.3.10. Russia
7.3.10.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.3.11. Rest of Europe
7.3.11.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.4. Asia-Pacific Country level Analysis
7.4.1. Asia-Pacific 3D ICs Market estimates and forecast with Growth rate analysis, By Substrate Type, 2016 – 2028
7.4.2. Asia-Pacific 3D ICs Market estimates and forecast with Growth rate analysis, By Fabrication Process, 2016 – 2028
7.4.3. Asia-Pacific 3D ICs Market estimates and forecast with Growth rate analysis, By Product, 2016 – 2028
7.4.4. Asia-Pacific 3D ICs Market estimates and forecast with Growth rate analysis, By End Use, 2016 – 2028
7.4.5. China
7.4.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.4.6. India
7.4.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.4.7. Japan
7.4.7.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.4.8. Korea
7.4.8.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.4.9. Australia
7.4.9.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.4.10. Southeast Asia
7.4.10.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.4.11. Rest of Asia-Pacific
7.4.11.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.5. South America Country level Analysis
7.5.1. South America 3D ICs Market estimates and forecast with Growth rate analysis, By Substrate Type, 2016 – 2028
7.5.2. South America 3D ICs Market estimates and forecast with Growth rate analysis, By Fabrication Process, 2016 – 2028
7.5.3. South America 3D ICs Market estimates and forecast with Growth rate analysis, By Product, 2016 – 2028
7.5.4. South America 3D ICs Market estimates and forecast with Growth rate analysis, By End Use, 2016 – 2028
7.5.5. Brazil
7.5.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.5.6. Argentina
7.5.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.5.7. Colombia
7.5.7.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.5.8. Rest of South America
7.5.8.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.6. Middle East & Africa Country level Analysis
7.6.1. MEA 3D ICs Market estimates and forecast with Growth rate analysis, By Substrate Type, 2016 – 2028
7.6.2. MEA 3D ICs Market estimates and forecast with Growth rate analysis, By Fabrication Process, 2016 – 2028
7.6.3. MEA 3D ICs Market estimates and forecast with Growth rate analysis, By Product, 2016 – 2028
7.6.4. MEA 3D ICs Market estimates and forecast with Growth rate analysis, By End Use, 2016 – 2028
7.6.5. GCC
7.6.5.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.6.6. South Africa
7.6.6.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
7.6.7. Rest of Middle East & Africa
7.6.7.1. Market estimates and forecast with Growth rate analysis, 2016 – 2028
Section 8: Company Profile - 3D ICs Market
8.1. MonolithIC 3D Inc.
8.1.1. Business Overview
8.1.2. Product & Service Offering
8.1.3. Overall Revenue
8.1.4. Strategic Outlook
8.2. Taiwan Semiconductor Manufacturing Company, Ltd
8.2.1. Business Overview
8.2.2. Product & Service Offering
8.2.3. Overall Revenue
8.2.4. Strategic Outlook
8.3. Elpida Memory, Inc.
8.3.1. Business Overview
8.3.2. Product & Service Offering
8.3.3. Overall Revenue
8.3.4. Strategic Outlook
8.4. Micron Technology, Inc.
8.4.1. Business Overview
8.4.2. Product & Service Offering
8.4.3. Overall Revenue
8.4.4. Strategic Outlook
8.5. Ziptronix, Inc.
8.5.1. Business Overview
8.5.2. Product & Service Offering
8.5.3. Overall Revenue
8.5.4. Strategic Outlook
8.6. The 3M Company,
8.6.1. Business Overview
8.6.2. Product & Service Offering
8.6.3. Overall Revenue
8.6.4. Strategic Outlook
8.7. STATS ChipPAC Ltd.
8.7.1. Business Overview
8.7.2. Product & Service Offering
8.7.3. Overall Revenue
8.7.4. Strategic Outlook
8.8. United Microelectronics Corporation
8.8.1. Business Overview
8.8.2. Product & Service Offering
8.8.3. Overall Revenue
8.8.4. Strategic Outlook
8.9. Tezzaron Semiconductor Corporation
8.9.1. Business Overview
8.9.2. Product & Service Offering
8.9.3. Overall Revenue
8.9.4. Strategic Outlook
8.10. XILINX, Inc.
8.10.1. Business Overview
8.10.2. Product & Service Offering
8.10.3. Overall Revenue
8.10.4. Strategic Outlook
*Market size and forecast will be provided from 2016-2028, and forecast period would be 2021-2028
*Details on financial performance and strategic moves and developments may not be captured for unlisted companies
*List of companies profiled in this TOC is tentative and may change after detailed analysis
